DYNATECH WAFER SPIN CLEANER

Spin cleaner system is used to remove dust and particles on to the surface of wafer or strip materials through water rinsing by spinner device.

Features:

 

· System control : PLC Control

· Adjustable DI water injection time

· DI Water flow rate : Max. 0.2ℓ/min

· DI Water supply pressure : 3.0kgf/cm²

· Spindle speed : 170-2300 rpm

· Hot Air Blow time : 1-9999 sec

· Water blow time : 1-9999 sec

· DI Water supply pressure : 3.0 Kgf/cm²

· DI Water flow rate : Max. 0.2ℓ/m

· Adjustable hot air blow time

· Dimension of System :                                           850(w) x 650(d) x 900(h)mm

· Weight of System : 200kgs

· Electric power : AC110/220VAC, Single phase, 15A, 50/60Hz

· Air pressure : 5-6kgs/cm²

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