DYNATECH WAFER MOUNTER SYSTEM

Model DT-SWM1500 is able to handle both 8 inch wafer and 12 inch wafer. Precut tape for Die attach process as well as Normal & UV tape can be applied With this machine and contributed to improve the better production by adding OCR Barcode label printer.

Features:

 

· Quick & Easy Conversion

· Capable of Normal, UV and Precut tape

· Excellent Tape Mount Quality with no bubble

· Special bonding chuck

· Patented Wafer cleaning system

· High throughput

· Long lasting cutting blade

· Less tape consumption

· Wafer/Ring frame presence is detected by sensor

· Special elevator design for easy loading/unloading

· Highly precise wafer positioning by pre-aligner

· Easy operation and maintenance by software calibration and troubleshooting guide

· Inline process

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Model DT-NWM1050DM is able to handle both 6-8 inch wafer and contributed to improve the better production by adding OCR Barcode label printer, UV Irradiator or B/G remover.

Features:

 

· Quick & Easy Conversion

· Capable of Normal, UV and Precut tape

· Excellent Tape Mount Quality with no bubble

· Special bonding chuck

· Patented Wafer cleaning system

· High throughput

· Long lasting cutting blade

· Less tape consumption

· Wafer/Ring frame presence is detected by sensor

· Special elevator design for easy loading/unloading

· Highly precise wafer positioning by pre-aligner

· Easy operation and maintenance by software calibration and troubleshooting guide

· Inline process

DT-SWM1040A is Equipment to attach dicing tape on the back side of wafer and ring frame before dicing process. This can be effectively at the small assembly line or R&D room.

Features:

 

· Quick & Easy Conversion

· Capable of Normal, UV and Precut tape

· Excellent Tape Mount Quality with no bubble

· Special bonding chuck

· Patented Wafer cleaning system

· High throughput

· Long lasting cutting blade

· Less tape consumption

· Wafer/Ring frame presence is detected by sensor

· Special elevator design for easy loading/unloading

· Highly precise wafer positioning by pre-aligner

· Easy operation and maintenance by software calibration and troubleshooting guide

· Inline process

Features:

 

· Automatic tape bonding by motorized roller

· Easy and quick conversion without tools

· Air bubble free mounting by self balance function

· Long cutting blade

· Tape lock by air cylinder (One touch air chucking)

· Wafer can be mounted at any position (0˚, 90˚,180˚ & 270˚)

· ESD elimination by blow type ionizer

· Micro filter to secure class #10

Features:

 

· Automatic tape bonding by motorized roller

· Easy and quick conversion without tools

· Air bubble free mounting by self balance function

· Long cutting blade

· Tape lock by air cylinder

           (One touch air chucking)

· Wafer can be mounted at any position

           (0˚, 90˚,180˚ & 270˚)

· ESD elimination by blow type ionizer

· Micro filter to secure class #10

We are Metrology. We are Microscope.