DYNATECH WAFER TAPE LAMINATION SYSTEM

This equipment is designed to laminate wafer B/G protective tape to the wafer pattern surface in order to protect wafer circuit from wafer breakage during back-grinding process.

Features:

 

· Capable of Bumping wafer by special bond roller

· 8-12 inch wafer capability

· Precision edge cutting for optimum wafer back-grinding

· High accuracy lamination by pre-aligner

· Air bubble free lamination

· No tape burr and tail after lamination

· Adjustable cutting blade angle

· Adjustable cutting force tension

· Special air blow & suction cleaner for particle free lamination

· Minimum tape consumption

· Easy tape setting by one touch locker

· High precise robotic handler

· Compact design suitable for small space

· Quick and easy conversion for different size wafer

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