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DYNATECH MOUNTING & DETAPING SYSTEM |
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For 300mm Ultra-Thin Wafer with CMG |
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Features:
· All process in a single machine (UV irradiation, Tape Mount, Detape, OCR Bar code print) · Capable of both 8 & 12 inch wafers · Small footprint · System integration with CMG · Wafer capability : 50 μm · Precut, Normal and UV tape capability · Air cleaning function for perfect dust free environment · Safe and quick handling for thin wafer · Stable tape removing device with special peeling bar · Simple structure for quick conversion system · High accuracy wafer centering · Wafer robotic hand with auto balance function · Convenient and quick frame cassette unloading · The operation system can be available in-line or stand alone. · Short delivery and Simple maintenance · Economical tape consumption method · Perfect blocking from UV Light |
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We are Metrology. We are Microscope. |
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System control |
PLC control |
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Monitor |
PLC Touch monitor |
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System color |
Ivory |
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UPH |
25 Sheets/Hr |
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Applicable wafer size |
8 & 12 inch |
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Frame stack capability |
More than 100 frames |
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Air consumption |
400 ℓ/m |
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Mount table temperature |
Up to 70˚C |
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Output elevator(Wafer frame) |
Dual frame cassette |
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Tape width |
8 inch (Normal: 300 mm, Precut : 290 mm) |
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12 inch(Normal : 420 mm, Precut : 390 mm) |
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UV Lamp length |
250 nm |
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UV Lamp intensity |
60,80 & 120 w/cm² |
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Lamp life time |
1000hr |
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Mount & Remove Tape lock |
One touch type(air cylinder) |
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Cutting wheel usage |
20,000 cut/blade |
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Quick tape change |
Within 2 minutes |
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Dimension of System |
1800 x 2400 x 2200mm(w x d x h) |
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System weight |
Approx.1800 kgs |
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Electric power |
AC110/220, Single phase, 50/60Hz |
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Air pressure |
5~6 kg/cm² |
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<Option> |
① In-line type |
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② Stand alone |
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③ Host communication(GEM,SECS I,II, HSMS) |