DYNATECH CHIP SORTING PICK & PLACE SYSTEM

This system is designed to place chip die into the various types of tray after picking up chip die following wafer dicing process.

Features:

 

· Wafer ring loading by operator

· Unloading cassette magazine(2sets)

· Chip loading position controlled by CCD camera

· UPH : 3000unit/hr

· Main system control : PLC control

· System size : 1150(w)x900(w)x1400(h)mm

· System weight : 500kgs

· Electric power : AC110/220VAC, Single phase, 50/60Hz

· Air pressure : 5-6kgs/cm²

· Option : GEM, SECS I, II, HSMS

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