DYNATECH ADHESIVE FILM CUT PICK & PLACE SYSTEM

This system is designed to place chip die into the various types of tray after picking up chip die following wafer dicing process.

Features:

 

· Application package: LQFP,SOC,TSOP,QDP,WSOP,FBGA

· 5 Magazine buffer system

· Over-load detect function

· Bonding stage heating function

· Tape placement for X & Y : +/-50 μm

· Rail wide adjustable

· L/F position controlled by CCD camera

· Easy tape conversion

· System control : PLC control

· System UPH : Min 400 unit/hr

· System size : 1650(w)x1100(w)x1800(h)mm

· System weight : Approx. 750 kgs

· Power : AC110/220VAC, Single phase, 50/60Hz

· Option : GEM, SECS I, II, HSMS

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