
Fully Automatic Wafer Mount System for 8 & 12 inch

- Quick & Easy Conversion
- Capable of Normal, UV and Precut tape
- Excellent Tape Mount Quality with no bubble
- Special bonding chuck
- Patented Wafer cleaning system
- High throughput
- Long lasting cutting blade
- Less tape consumption
- Wafer/Ring frame presence is detected by sensor
- Special elevator design for easy loading/unloading
- Highly precise wafer positioning by pre-aligner
- Easy operation and maintenance by software calibration and troubleshooting guide
- Inline process
Wafer cassette loading >>> Wafer alignment >>> Frame chucking >>>
Wafer chucking >>> Tape feeding >>> Tape mounting >>>
OCR Barcode scanner >>> Label attachment >>> Off-loading to frame magazine
Applicable wafer size | 8 & 12 inch |
Applicable wafer thickness | 8 inch(150~800 um) |
12 inch(330~800 um) | |
Applicable frame size | 8 & 12 inch |
Applicable dicing tape | Normal, UV & 3 Layer precut tape |
Throughput | ① 8 & 12 inch(50 Frames/hr) For Normal tape |
② 8 & 12 inch(40 Frames/hr) For Precut tape | |
Mount accuracy | +/-0.5 mm, +/-0.5 degree |
Wafer cassette | Dual loading |
Frame cassette | Dual loading |
Frame stock | More than 100 frame stock |
Controller | PLC |
Ionizer | Ionizing air blower(ESD elimination) |
Cutter blade usage | More than 10,000 cut/blade |
Chuck heat control | Up to 70˚C |
Dimension | 2070 x 1700 x 2000mm(w x d x h) |
Weight of machine | 1200kgs |
Power | 110/220VAC, 1 Phase |
Air supply | 5~6kgs/cm² |
Host communication(GEM,SECS I,II, HSMS) |
Fully Automatic Wafer Mount System is specially designed to attach dicing tape
on the back side of wafer and ring frame automatically, which contributes to
improve quality and productivity in wafer dicing and die mount process.
Model DT-SWM1500 is able to handle both 8 inch wafer and 12 inch wafer.
Precut tape for Die attach process as well as Normal & UV tape can be
applied With this machine and contributed to improve the better production
by adding OCR Barcode label printer